PCB Surface Treatment

1、Immersion Gold board

　　Immersion Gold Board Process costs are the highest of all plates, but now all of the existing plate is the most stable and most suitable for use in lead-free process of the plate, especially in some high-priced or require high reliability electronic products are recommended to use This plate as the substrate.","

2、OSP  PCB

　　OSPProcess lowest cost, easy to operate, but this process due to be fitted with plant modifications equipment and process conditions and heavy poor and therefore popularity still poor, use this class plate, after high-temperature heating, pre-coated on the PAD the protective film is bound to be undermined, leading solder is reduced, particularly when the substrate after the second reflow the situation is more serious, so if still need to go through the process once the DIP process, then the DIP solder side will face challenges on.

3、Silver plate

　　Although the %"silver%" itself has a strong mobility, resulting in the case of the occurrence of leakage, but today's %"immersion silvering%" is not a conventional pure metallic silver, but with organic co-plating %"organic silver%" have therefore been able to meet the future Demand on the lead-free process, which can also weldability life longer than OSP board。 

4、Of gold plate

　　The biggest problem is the point of such a board, %"black mat%" (BlackPad) problem, so the lead-free process there are many manufacturers do not agree to use, but CB domestic manufacturers mostly use this process。 

5、Tin plate

　　Such substrates easily contaminated, scratches, plus process (FLUX) oxidation discoloration will occur, most domestic manufacturers do not use this process, the relatively high cost。 

6、HASL

　　Because low-cost, good solderability, good reliability, compatibility of the strongest, but this good welding characteristics due to the presence of lead spray tin plate, so you can not use lead-free process.